Display device

ABSTRACT

A structure including a first resin layer and a second resin layer sandwiching a self-light emitting element layer, a first stopper layer, a first resin sacrificial layer and a first glass substrate which are stacked on the first resin layer on the opposite side of the self-light emitting element layer, and a second glass substrate stacked on the second resin layer is prepared. The first glass substrate is peeled off from the first resin sacrificial layer by irradiating the first glass substrate with a laser beam. The first resin sacrificial layer is decomposed by a chemical reaction using a gas. The first stopper layer has a resistance to the chemical reaction, and the first resin sacrificial layer is removed while leaving the first stopper layer in a step of decomposing the first resin sacrificial layer.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese applicationJP2015-054987 filed on Mar. 18, 2015, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a display device and a method ofmanufacturing the display device.

2. Description of the Related Art

In manufacturing processes for manufacturing a sheet-shaped displaydevice, there is a process in which a resin layer is peeled off from aglass substrate by using a laser beam and so on after the resin layersuch as polyimide and a self-light emitting element layer are stacked onthe glass substrate. More specifically, the resin layer is peeled offfrom the glass substrate by ablation of a material occurring due toenergy of the laser beam on a surface of the resin layer. At this time,a minute product generated by ablation may adhere to the surface of theresin layer and remain thereon. The product (hereinafter referred toalso as a “residual product”) will be also a factor of reduction ofyields and a factor of deterioration in display quality due to mixing ofbubbles and so on in subsequent processes.

As a method of removing the residual product, a dry air cleaning or awet cleaning (for example, a pure water cleaning) can be cited. Whenperforming the wet cleaning, there is a concern that the resin layerabsorbs moisture and the moisture reaches the self-light emittingelement layer to cause deterioration.

In JP 2008-159600 A, a structure in which infiltration of moisture isprevented by surrounding a layer having a property absorbing moisturewith a first and second moisture block layers.

However, there may be a case where the residual product adheres firmlyby static electricity, and there is a concern that the residual productstill remains on the surface even when using the above removal method.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method ofmanufacturing a display device capable of removing a residual productmore effectively as compared with a case where the dry air cleaning orthe wet cleaning is used.

According to an embodiment of the present invention, there is provided amethod of manufacturing a display device including the steps ofpreparing a structure including a self-light emitting element layerwhich plural self-light emitting type pixels comprise, a first resinlayer and a second resin layer sandwiching the self-light emittingelement layer, a first stopper layer stacked on the first resin layer onthe opposite side of the self-light emitting element layer, a firstresin sacrificial layer stacked on the first stopper layer on theopposite side of the self-light emitting element layer, a first glasssubstrate stacked on the first resin sacrificial layer on the oppositeside of the self-light emitting element layer, and a second glasssubstrate stacked on the second resin layer on the opposite side of theself-light emitting element layer, peeling off the first glass substratefrom the first resin sacrificial layer by irradiating the first glasssubstrate with a laser beam and decomposing the first resin sacrificiallayer by a chemical reaction using a gas, in which the first stopperlayer has a resistance to the chemical reaction, and the first resinsacrificial layer is removed while leaving the first stopper layer inthe step of decomposing the first resin sacrificial layer. According tothe method, it is possible to remove the residual product effectively ascompared with the case of using the dry air cleaning or the wetcleaning.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a display device according to anembodiment of the present invention;

FIG. 2 is a cross-sectional view showing an example of a configurationof the display device;

FIG. 3 is a schematic cross-sectional view showing a first structure asa portion of the display device in a manufacturing stage;

FIG. 4 is a schematic cross-sectional view showing a second structure asa portion of the display device in a manufacturing stage;

FIG. 5 is a schematic cross-sectional view showing the display device ina manufacturing stage;

FIG. 6 is a schematic cross-sectional view showing a portion of thedisplay device in a manufacturing stage;

FIG. 7 is a schematic cross-sectional view showing a portion of thedisplay device in a manufacturing stage;

FIG. 8 is a schematic cross-sectional view showing a portion of thedisplay device in a manufacturing stage;

FIG. 9 is a schematic cross-sectional view showing a portion of thedisplay device in a manufacturing stage;

FIG. 10 is a schematic cross-sectional view showing a portion of thedisplay device in a manufacturing stage;

FIG. 11 is a schematic cross-sectional view showing a portion of thedisplay device in a manufacturing stage;

FIG. 12 is a schematic cross-sectional view showing a portion of thedisplay device in a manufacturing stage;

FIG. 13 is a schematic cross-sectional view showing a portion of thedisplay device in a manufacturing stage;

FIG. 14 is a schematic cross-sectional view showing a second structureformed in a modification example; and

FIG. 15 is a schematic cross-sectional view showing a portion of adisplay device formed in the modification example.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, a mode for carrying out the invention (hereinafter referredto as an embodiment) will be explained. The disclosure of thespecification is just an example of the present invention, and properalternations keeping the gist of the present invention, at which thoseskilled in the art can easily arrive are included in the scope of theinvention. The width, the thickness, the shape and so on of respectiveparts shown in the drawings are schematically shown, which do not limitthe interpretation of the present invention.

1. Outer Appearance of Display Device

FIG. 1 is a perspective view showing an outer appearance of a displaydevice 1 according to the embodiment of the present invention. Thedisplay device 1 formed in a sheet shape has flexibility, which iscapable of display the contents of acquired image information and thelike on a display area 5 formed on a surface of the display device 1even when the display device is bent.

2. Configuration of Display Device

FIG. 2 is a cross-sectional view showing an example of a configurationof the display device 1. As shown in the drawing, a self-light emittingelement layer 50 including self-light emitting type light emittingelements is formed in the display device 1. Here, the self-lightemitting element layer 50 is a layer formed in a planar shape, havingtwo surfaces corresponding to a surface and a rear surface. In thefollowing description, one surface of the self-light emitting elementlayer 50 is referred to as a first surface and the other surface of theself-light emitting element layer 50 is referred to as a second surface.In the cross-sectional view of FIG. 2, an upper surface (II-1) of theself-light emitting element layer 50 corresponds to the first surfaceand a lower surface (II-2) corresponds to the second surface.

Also as shown in FIG. 2, a sealing layer 60, a filling layer 90, anovercoat layer 80, a color filter layer 70, a first barrier layer 11, afirst resin layer 10, a first stopper layer 13 and a first repair layer14 are stacked on the first surface's side of the self-light emittingelement layer 50, and a first protective film 15 is bonded to an outersurface of the first repair layer 14. Also as shown in the drawing, aplanarization layer 40, a circuit layer 30, a second barrier layer 21, asecond resin layer 20, a second stopper layer 23 and a second repairlayer 24 are stacked on the second surface's side of the self-lightemitting element layer 50, and a second protective film 25 is bonded toan outer surface of the second repair layer 24.

The display device 1 according to the embodiment adopts a top emissiontype, which is configured to emit light from the first surface's side ofthe self-light emitting element layer 50. Accordingly, the sealing layer60, the filling layer 90, the overcoat layer 80, the color filter layer70, the first barrier layer 11, the first resin layer 10, the firststopper layer 13 and the first repair layer 14 and the first protectivefilm 15 are respectively formed of materials which transmit light(transparent materials, semitransparent materials colored by givencolors or the like).

Here, plural self-light emitting type pixels formed by the self-lightemitting element layer 50 are provided in the display area 5 of thedisplay device 1 (see FIG. 1). More specifically, the self-lightemitting element layer 50 is formed by including an organic layer 53 inwhich a charge transfer layer, a charge injection layer, light emittingelements and so on are stacked as shown in FIG. 2. When electricityflows in the organic layer 53, the self-light emitting element layer 50emits light of pixels.

Also as shown in FIG. 2, a bank layer 51, pixel electrodes 52 and acommon electrode 54 are formed in the self-light emitting element layer50 so as to cover a surface and a rear surface of the organic layer 53.Here, the bank layer 51 is formed of an insulator such as a resin, whichis arranged so as to surround respective outer peripheries of pluralpixels. The bank layer 51 is arranged in this manner, thereby preventingcontact of pixel electrodes 52 adjacent between pixels.

The pixel electrodes 52 are formed of a given conductive material andprocessed (for example, etching processing) so as to be cut off from oneanother in respective pixels. When the top emission type is adopted asin the embodiment, the pixel electrodes 52 may include a material whichreflects light such as metals (for example, Ag). The common electrode 54is formed of ITO (Indium Tin Oxide) or IZO (indium zinc oxide), however,materials are not limited to them as long as they are transparentconductive materials. The organic layer 53 and the common electrode 54may be arranged over the entire pixels in the display area 5.

Also as shown in FIG. 2, the planarization layer 40 and the circuitlayer 30 are stacked on the second surface's side of the self-lightemitting element layer 50. Here, the planarization layer 40 is formed ofan insulator such as a resin, and has holes formed at positionscontacting parts of a later-described drive wiring 32. Part of the pixelelectrode 52 enters the hole and contacts the drive wiring 32.

The circuit layer 30 is formed by including circuit portions 31 forcontrolling image display in the display area 5. The circuit portion 31includes a TFT (thin-film transistor) and a capacitance, controlling thesupply of electric current with respect to the pixel electrode 52. Morespecifically, when the drive TFTs included in the circuit portions 31are turned on, the electric current flows in the drive wiring 32connected to the drive TFTs, the pixel electrodes 52, the organic layer53, and the common electrode 54 which are electrically connected to thedrive wiring 32 to thereby emit light of pixels from the organic layer53.

Furthermore, as shown in FIG. 2, the color filter layer 70 is formed onthe first surface's side of the self-light emitting element layer 50.Here, the color filter layer 70 is formed by including color filters71R, 71G and 71B which are red, green and blue and are respectivelytransmit light. Here, when light emitted from the organic layer 53 istransmitted through the above color filters 71R, 71G and 71B, lightcorresponding to a color of a pixel is emitted.

Also as shown in FIG. 2, the sealing layer 60, the filling layer 90 andthe overcoat layer 80 are stacked between the self-light emittingelement layer 50 and the color filter layer 70. The sealing layer 60 isformed of SiO or SiN, having a function of protecting the self-lightemitting element layer 50 from moisture included in the filling layer90. The overcoat layer 80 is formed of, for example, an organicmaterial, having a function of preventing diffusion of dyes of colorsincluded in the color filters 71R, 71G and 71B. The details of thefilling layer 90 will be described later.

Also as shown as FIG. 2, the first resin layer 10 is formed on the firstsurface's side of the self-light emitting element layer 50 and thesecond resin layer 20 is formed on the second surface's side of theself-light emitting element layer 50 in the display device 1. The firstresin layer 10 and the second resin layer 20 have flexibility and allowbending in a vertical direction in the cross section of FIG. 2 andstretching in a direction along the surface of the display device 1 tosome degree. The material for the first resin layer 10 and the secondresin layer 20 may be polyimide, however, it is not limited to this aslong as materials have flexibility and transmit light when used for thefirst resin layer 10. The second resin layer 20 may be formed to beopaque if it is not necessary to transmit light from the self-lightemitting element layer 50 or from the back of the display device 1.

Also as shown as FIG. 2, the first barrier layer 11 is formed betweenthe first resin layer 10 and the color filter layer 70, and the secondbarrier layer 21 is formed between the second resin layer 20 and thecircuit layer 30. The first barrier layer 11 and the second barrierlayer 21 are for preventing infiltration of moisture and impurities tothe self-light emitting element layer 50, the circuit layer 30 and soon, which are formed by stacking, for example, SiO and SiN.

Also as shown as FIG. 2, the first stopper layer 13 and the secondstopper layer 23, the first repair layer 14 and the second repair layer24, the first protective film 15 and the second protective film 25 arerespectively stacked in the display device 1. The first protective film15 and the second protective film 25 are layers for protecting layersinside these films from scratches and stains. The first protective film15 and the second protective film 25 are formed by using, for example,PET as a material, having adhesion layers (not shown) for adhering torespective surfaces of the first stopper layer 13 and the second stopperlayer 23. The first stopper layer 13, the second stopper layer 23, thefirst repair layer 14 and the second repair layer 24 will be explainedlater.

3. Method of Manufacturing Display Device

Here, a method of manufacturing the display device 1 according to theembodiment will be explained with reference to FIG. 3 to FIG. 9.

FIG. 3 is a schematic cross-sectional view showing a first structure asa portion of the display device 1 in a manufacturing stage. As shown inFIG. 3, a first structure 100 in which a first resin sacrificial layer102, the first stopper layer 13, the first resin layer 10, the firstbarrier layer 11, the color filter layer 70 and the overcoat layer 80are stacked in this order on a first glass substrate 101 is prepared ina manufacturing process of the display device 1.

Here, the first resin sacrificial layer 102 is a layer decomposed andremoved from the first stopper layer 13 in a subsequent process forpreventing adverse effects to the first resin layer 10 at the time ofpeeling off the first glass substrate 101 and for removing a residualproduct 105 adhering at that time. The first resin sacrificial layer 102is formed by using polyimide as a material in the same manner as thefirst resin layer 10 as an example. In this case, the first resinsacrificial layer 102 may be formed by a method of applying a solutionof polyimide on the first glass substrate 101 and baking and hardeningthe solution by baking treatment, and the first resin sacrificial layer102 may also be formed by adhering a film sheet of polyimide to thefirst glass substrate 101.

The first stopper layer 13 has a function of protecting the first resinlayer 10 when the first resin scarifying layer 102 is decomposed in thesubsequent process. As materials for the first stopper layer 13, SiO,SiN, ITO, IZO, Al₂O₃ and so on can be cited. The first stopper layer 13may be formed by including SiO or SiN by using a CVD method, may beformed by including ITO or IZO by a using sputtering method, and may beformed by using Al₂O₃ by using an ALD (Atomic layer deposition) method.The first stopper layer 13 is formed to be transparent so as to transmitlight of pixels emitted from the self-light emitting element layer 50.

FIG. 4 is a schematic cross-sectional view showing a second structure asa portion of the display device 1 in a manufacturing stage. As shown inFIG. 4, a second structure 200 in which a second resin sacrificial layer202, the second stopper layer 23, the second resin layer 20, the secondbarrier layer 21, the circuit layer 30, the planarization layer 40, theself-light emitting element layer 50 and the sealing layer 60 arestacked in this order on a second glass substrate 201 is prepared in amanufacturing process of the display device 1.

Here, the second resin sacrificial layer 202 is a layer decomposed andremoved from the second stopper layer 23 in a subsequent process forpreventing adverse effects to the second resin layer 20 at the time ofpeeling off the second glass substrate 201 and for removing a residualproduct 205 adhering at that time. The second resin sacrificial layer202 is formed by using polyimide as a material as an example in the samemanner as the second resin layer 20, the first resin layer 10 and thefirst resin sacrificial layer 102.

The second stopper layer 23 has a function of protecting the secondresin layer 20 when the second resin scarifying layer 202 is decomposedin the subsequent process. The second stopper layer 23 may be formed byusing, for example, SiO, SiN, ITO, IZO, Al₂O₃ and so on as materials inthe same manner as the first stopper layer 13. The second stopper layer23 may be formed to be opaque.

FIG. 5 shows the display device 1 in a manufacturing stage, which is aschematic cross-sectional view showing a structure in which the firststructure 100 and the second structure 200 are bonded to each otherthrough the filling layer 90. The filling layer 90 is formed byincluding a transparent filler and a seal material 91 functioning as adam for the filler. In a manufacturing process of the display device 1,the filling layer 90 is arranged on the second structure 200 shown inFIG. 4, and the first structure 100 shown in FIG. 3 is bonded thereto byturning over the first structure 100 shown in FIG. 3 in the verticaldirection, thereby forming one structure as the display device 1.

As described above, in the manufacturing process of the display device 1according to the embodiment, the structure including the self-lightemitting element layer 50, the first resin layer 10 and the second resinlayer 20 sandwiching the self-light emitting element layer 50, the firststopper layer 13 stacked on the first resin layer 10 on the oppositeside of the self-light emitting element layer 50, the first resinsacrificial layer 102 staked on the first stopper layer 13 on theopposite side of the self-light emitting element layer 50, the firstglass substrate 101 staked on the first resin sacrificial layer 102 onthe opposite side of the self-light emitting element layer 50 and thesecond glass substrate 201 staked on the second resin layer 20 on theopposite side of the self-light emitting element layer 50 is prepared.The structure further includes the second stopper layer 23 staked on thesecond resin layer 20 on the opposite side of the self-light emittingelement layer 50 and the second resin sacrificial layer 202 staked onthe second stopper layer 23 on the opposite side of the self-lightemitting element layer 50, and the second glass substrate 201 is stakedon the second resin sacrificial layer 202 on the opposite side of theself-light emitting element layer 50. The structure further includes thecolor filter layer 70 interposed between the self-light emitting elementlayer 50 and the first resin layer 10 and the circuit layer 30interposed between the self-light emitting element layer 50 and thesecond resin layer 20.

FIG. 6 is a schematic cross-sectional view showing a portion of thedisplay device 1 in a manufacturing stage, which is a view showing anexample of a stage where the first glass substrate 101 is peeled offfrom the display device 1. In the manufacturing process of the displaydevice 1, the first glass substrate 101 is irradiated with a laser beam300 to change a property of a contact surface of the first resinsacrificial layer 102 contacting the first glass substrate 101 by heat,thereby peeling off the first glass substrate 101 from the first resinsacrificial layer 102. That is, ablation due to the layer beam 300occurs on the surface of the first resin sacrificial layer 102, thefirst resin sacrificial layer 102 is peeled off from the first glasssubstrate 101.

As the first resin sacrificial layer 102 is further stacked on the firstresin layer 10 in the manufacturing method according to the embodiment,the thickness of the resin layer can be increased at the time ofirradiation of the laser beam 300 as compared with a related-art methodin which only the first resin layer 10 is stacked. Therefore, theadverse effects (damage to the self-light emitting element layer 50 andso on) to the self-light emitting element layer 50 due to laser energyof the laser beam 300 can be reduced.

Here, the minute residual product 105 mainly containing carbon isgenerated on a surface of the first resin sacrificial layer 102 by theablation due to the laser beam 300. The residual product 105 adheres tothe surface of the first resin sacrificial layer 102 at the time ofpeeling off the first glass substrate 101.

Incidentally, in the case where the protective film is bonded to thesurface in a state where the residual product 105 adheres to thesurface, bubbles easily enter the inside of the protective film due tothe influence of the residual product 105, which will be a factor ofreducing yields. Accordingly, it is necessary to remove the residualproduct 105 from the surface of the display device 1, however, most ofthe residual products 105 have sizes smaller than 1 μm, and may adherefirmly by static electricity. Therefore, the residual product 105 maystill remain on the surface of the display device 1 even when a dry aircleaning or a wet cleaning is used.

When irradiation of the laser beam 300 is performed in a state wherethere is a foreign matter on the first resin sacrificial layer 102, thefirst resin sacrificial layer 102 is chipped as the foreign matter isburned or sublimes, which causes the reduction of yields in subsequentprocesses.

Accordingly, in the manufacturing process of the display device 1, theresidual product 105 is removed together with the first resinsacrificial layer 102 by decomposing the first resin sacrificial layer102 by a chemical reaction using a gas containing oxygen, fluorine orthe like.

FIG. 7 is a schematic cross-sectional view showing a portion of thedisplay device 1 in a manufacturing stage, which is a view showing anexample of a stage in which the first resin sacrificial layer 102 isremoved from the portion of the display device 1 shown in FIG. 6. Asshown in FIG. 7, the first resin sacrificial layer 102 is decomposedinto an organic compound 106, for example, by performing processing (dryetching) in which gas containing oxygen or fluorine is converted intoplasma by high frequency and a generated plasma 400 is applied to thefirst resin sacrificial layer 102 to be chemically reacted.

Though the first resin sacrificial layer 102 is decomposed by the abovechemical reaction, the first stopper layer 13 has a resistance to thechemical reaction, and the first stopper layer 13 is not decomposed andremains in the above process. In the manufacturing process of thedisplay device 1, the first resin sacrificial layer 102 is removedtogether with the residual product 105 while leaving the first stopperlayer 13. According to this process, the residual product 105 does notremain on the surface of the first stopper layer 13 and progress of thechemical reaction to the first resin layer 10 is suppressed, therefore,the reduction of yields in subsequent processes can be prevented.

FIG. 8 is a schematic cross-sectional view showing a portion of thedisplay device 1 in a manufacturing stage, which is a view showing anexample in which the portion of the display device 1 shown in FIG. 7 isenlarged. As sown in FIG. 8, a chipped portion (hereinafter alsoreferred to as a first pinhole 107) may be generated in the firststopper 13. The first pinhole 107 is generated in a stage of forming thefirst stopper layer 13 by the CVD method or generated when a foreignmatter mixed in the first stopper layer 13 reacts with the plasma 400 inthe chemical reaction processing (for example, dry etching) at the timeof removing the first resin sacrificial layer 102. In the case where thefirst protective film 15 is bonded to the first stopper layer 13 in astate where the first pinhole 107 remains in the above manner, moistureremaining in the first protective film 15 or moisture infiltrated fromthe outside thereof reaches the first resin layer 10, which leads todeterioration.

Accordingly, in the manufacturing process of the display device 1, thefirst repair layer 14 is formed over the first stopper layer 13 afterthe process of decomposing the first resin sacrificial layer 102, andthe first protective film 15 is bonded to a surface of the first repairlayer 14.

FIG. 9 is a schematic cross-sectional view showing a portion of thedisplay device 1 in a manufacturing stage, which is a view showing anexample in which the first repair layer 14 and the first protective film15 are formed in the display device 1 shown in FIG. 8. As shown in FIG.9, the first repair layer 14 is provided so as to bury the first pinhole107 in the first stopper layer 13. The first repair layer 14 may have asingle-layer structure including SiO, SiN, acrylic, PET, a fluorineresin or the like, a stacked-layer structure including Al₂O₃ and SiO (orSiN), a stacked-layer structure including acrylic and SiO (or SiN) orthe like. When the first repair layer 14 is provided between the firststopper layer 13 and the first protective film 15, it is possible toimprove an ability of blocking moisture infiltrated through the firstprotective film 15.

FIG. 10 is a schematic cross-sectional view showing a portion of thedisplay device 1 in a manufacturing stage, which is a view showing astate in which the second glass substrate 201 is peeled off from thedisplay device 1. In the manufacturing process of the display device 1,the second glass substrate 201 stacked on the second surface's side ofthe self-light emitting element layer 50 is irradiated with the laserbeam 300 after the first protective film 15 is bonded, a property of acontact surface of the second resin sacrificial layer 202 contacting thesecond glass substrate 201 is changed by heat, thereby peeling off thesecond glass substrate 201 from the second resin sacrificial layer 202.Also in this case, the minute residual product 205 is generated on thecontact surface of the second resin sacrificial layer 202 and adheres tothe surface of the second resin sacrificial layer 202 in the same manneras in the case of peeling off the first glass substrate 101.

FIG. 11 is a schematic cross-sectional view showing a portion of thedisplay device 1 in a manufacturing stage, which is a view showing astate where the second sacrificial layer 202 is removed from the portionof the display device 1 shown in FIG. 10. In the manufacturing processof the display device 1, the residual product 205 is removed from thesurface of the display device 1 in the forming stage by decomposing thesecond resin sacrificial layer 202 into an organic compound 206 by thechemical reaction (dry etching) using the gas containing oxygen orfluorine. Here, the second stopper layer 23 may be formed by the samematerial and method as the first stopper layer 13, and the secondstopper layer 23 has a resistance to the chemical reaction using thegas. Accordingly, the second resin sacrificial layer 202 is removedwhile leaving the second stopper layer 23 by using the chemical reactionsuch as dry etching in the present process. As the residual product 205is removed together with the second resin sacrificial layer 202 also inthe second surface's side of the self-light emitting element layer 50and the progress of the chemical reaction to the second resin layer 20is suppressed as described above, the reduction of yields in subsequentprocesses can be prevented.

FIG. 12 is a schematic cross-sectional view showing a portion of thedisplay device 1 in a manufacturing stage, which is a view showing anexample in which the portion of the display device 1 shown in FIG. 11 isenlarged. As shown in FIG. 12, a chipped portion (hereinafter alsoreferred to as a second pinhole 207) may occur in the second stopper 23due to mixing of a foreign matter in the process of decomposing thesecond resin sacrificial layer 202.

Accordingly, in the manufacturing process of the display device 1, thesecond repair layer 24 is formed over the second stopper layer 23 afterthe process of decomposing the second resin sacrificial layer 202, andthe second protective film 25 is bonded to a surface of the secondrepair layer 24.

FIG. 13 is a schematic cross-sectional view showing a portion of thedisplay device 1 in a manufacturing stage, which is a view showing anexample in which the second repair layer 24 and the second protectivefilm 25 are formed in the display device 1 shown in FIG. 12. As shown inFIG. 13, the second repair layer 24 is provided so as to bury the secondpinhole 207 in the second stopper layer 23, namely, so as to repair thedefect of the second repair layer 24. The second repair layer 24 may beformed of the same materials as the first repair layer 14 and by thesame method as the first repair layer 14. When the second repair layer24 is provided between the second stopper layer 23 and the secondprotective film 25, it is possible to improve an ability of blockingmoisture infiltrated through the second protective film 25 also on thesecond surface's side.

4. Modification Examples

The present invention is not limited to the above explained embodimentand may be modified in various ways. Hereinafter, examples of othermodes for carrying out the present invention (modification examples)will be explained.

(1) In the embodiment, the method of manufacturing the display device 1which has steps of forming the first resin sacrificial layer 102 and thesecond resin sacrificial layer 202 on the surface side and the rearsurface side of the display device 1 respectively and removing theselayers by the chemical processing to thereby remove the residual product105 has been explained. However, light of pixels emitted from theself-light emitting element layer 50 is transmitted through the firstresin layer 10 and outputted from a surface on one side of the displaydevice 1, therefore, if bubbles are mixed to the surface of the secondresin layer 20, the display of images is hardly affected. Accordingly,remanence of the residual product generated at the time of peeling offthe glass substrate is allowed on the second surface's side in thedisplay device 1 in the modification example.

FIG. 14 is a schematic cross-sectional view showing a second structureformed in the modification example. As shown in FIG. 14, in the secondstructure (200-2) according to the modification example, the secondstopper layer 23 and the second resin sacrificial layer 202 (refer toFIG. 4) are not formed and a second resin layer (20-2) is stacked so asto contact a glass substrate (201-2). The second structure (200-2) isbonded to the first structure (see FIG. 3) which is the same as theembodiment to form one structure to be a base of a display device (1-2).

Also in the manufacturing process of the display device (1-2: see FIG.15) according to the modification example, the glass substrate (201-2)is peeled off from the second resin layer (20-2) by irradiation of thelaser beam. At this time, ablation occurs on a contact surface of thesecond resin layer (20-2), and a residual product (205-2) (not shown) isgenerated in the same manner as the embodiment and adheres to thesurface of the second resin layer (20-2).

FIG. 15 is a schematic cross-sectional view showing a portion of thedisplay device (1-2) formed in the modification example. As shown inFIG. 15, a second protective film (25-2) is bonded in a state where theresidual product (205-2) adheres to the surface of the second resinlayer (20-2). The risk in which bubbles enter the inside of the secondprotective film (25-2) is increased by the above processing, the processof forming the second stopper layer 23 and the second resin sacrificiallayer 202 and the process of removing the second resin sacrificial layer202 performed in the embodiment can be omitted, therefore, it ispossible to manufacture the display device simply and inexpensively ascompared with the embodiment.

(2) In the embodiment, the case where the sealing layer 60, the fillinglayer 90, the overcoat layer 80, the color filter layer 70, the secondbarrier layer 21, the second resin layer 20, the second stopper layer23, the second repair layer 24 and the second protective film 25 areformed of materials which transmit light (transparent materials,semitransparent materials colored to given colors and so on) which arearranged on the second surface's side for emitting light of pixels fromthe second surface's side of the self-light emitting element layer 50 inthe display device 1 has been explained. However, members other than theabove may be transparent for allowing light incident from the back ofthe display device 1 to be transmitted therethrough. That is, theplanarization layer 40, the circuit layer 30, the second barrier layer21, the second resin layer 20, the second stopper layer 23, the secondrepair layer 24, the second protective film 25 may be respectivelyformed of transparent or semitransparent materials for allowing lightfrom the back to be transmitted therethrough.

While there have been described what are at present considered to becertain embodiments of the invention, it will be understood that variousmodifications may be made thereto, and it is intended that the appendedclaim cover all such modifications as fall within the true spirit andscope of the invention.

What is claimed is:
 1. A display device comprising: a first resin layer;a first inorganic material on the first resin layer; a second inorganicmaterial on the first inorganic material; a first flexible substrate onthe second inorganic material; a function layer which is arranged on thefirst flexile substrate and includes a plurality of pixels arranged in amatrix, each of the plurality of pixels including a thin film transistorand an organic emitting element connected to the thin film transistor;and a second flexible substrate on the function layer, wherein in planview, each of the first resin layer, the first inorganic material, thesecond inorganic material, the first flexible substrate, and the secondflexible substrate covers the plurality of pixels, the first inorganicmaterial differs from the second inorganic material, an upper surface ofthe first inorganic material is in contact with the second inorganicmaterial, and an upper surface of the second inorganic material is incontact with the first flexible substrate.
 2. The display deviceaccording to claim 1, further comprising: a sealing film which includesa first region having a first width and a second region having a secondwidth; and a filler including a resin material, wherein the sealing filmis arranged between the function layer and the second flexiblesubstrate, the filler is arranged between the sealing film and thesecond flexible substrate, the organic light emitting element includesan anode; an organic light emitting layer on the anode; and a cathode onthe organic light emitting layer, the function layer includes aninsulation bank which is between the anode and the organic lightemitting layer, covers a peripheral region of an upper surface of theanode, and expose a central region of the upper surface of the anode,and the first width directly above the peripheral region is smaller thanthe second width directly above the central region.
 3. The displaydevice according to claim 1, wherein the second inorganic material has afirst pinhole penetrating the second inorganic material, a part of thefirst inorganic material buries the first pinhole.
 4. The display deviceaccording to claim 1, wherein the first inorganic material is an ALDlayer.
 5. The display device according to claim 4, wherein the secondinorganic material is a CVD layer.
 6. The display device according toclaim 1, wherein the first inorganic material includes Al₂O₃.
 7. Thedisplay device according to claim 6, wherein the second inorganicmaterial includes SiO or SiN.
 8. The display device according to claim1, wherein the first resin layer includes PET.